Specializing in IC packaging planning, design, simulation, manufacturing, ATE testing, reliability testing, and mass production solutions — providing total turnkey solutions for integrated circuit packaging production.
Contact UsMetercore Technology focuses on advanced packaging as its core technical strength. Our team brings over 10 years of average experience in the semiconductor industry, with extensive project experience and technical expertise in single-chip and multi-chip packaging solutions for high-speed signals (PCIe 5/6, DDR5, UCIe, 112G SerDes), large-scale integration, high current, high power consumption, and advanced process technologies — offering customers integrated Total Solutions.
The company is certified to GB/T24001-2016 / ISO14001:2015, GB/T45001-2020 / ISO45001:2018, GB/T19001-2016 / ISO9001:2015, and recognized as a High-Tech Enterprise. We adhere to the philosophy of "Integrity First, Win-Win Cooperation," delivering professional, high-quality products and services to our customers.
Providing comprehensive packaging planning services aligned with chip product definition and mass production targets — covering package selection, structural architecture, material systems, DFM (Design for Manufacturability), and cost evaluation. Based on chip performance, power consumption, interface speed, and application scenarios, we help customers establish manufacturable, testable, and scalable packaging technology roadmaps at the earliest project stages.
Delivering high-performance packaging design and multi-physics co-simulation services covering Signal Integrity (SI), Power Integrity (PI), thermal analysis, and warpage/stress analysis. Supporting all major package forms, combined with high-speed interfaces and complex system requirements, we provide integrated engineering support from design verification to mass production introduction — enhancing product stability and first-pass success rates.
Leveraging mature supply chain collaboration capabilities, we provide packaging manufacturing services from prototype to mass production. Through extensive industry experience, full-process technical management, and process quality control, we ensure stable yield, consistency, and reliability performance for packaging solutions at the manufacturing end.
Providing complete CP/FT ATE test solutions, including test architecture planning, test item definition, hardware design, software development, and production introduction support. We ensure product quality while effectively reducing test costs and production risks.
Establishing comprehensive chip reliability verification programs based on product application environments and industry standards, covering HTOL, TC, uHAST/HAST, ESD, Latch-up, and failure analysis. Combined with package structure, material, and process characteristics, we provide customers with reliability assurance for mass production and long-term stable operation.
FCBGA / Fan-in / Fan-out / QFN / LGA / WBBGA
SI/PI Analysis / Thermal / Warpage Stress
Full-Process Technical & Quality Management
CP/FT ATE / HTOL / TC / ESD / Failure Analysis
We possess comprehensive advanced packaging development capabilities for high-performance, high-reliability chips — covering single-chip to multi-die (SiP) system-level packaging solutions. Supporting high I/O count, high bandwidth, high power, and complex heterogeneous integration requirements, we deliver optimal package architecture and manufacturing pathways tailored to diverse product application scenarios.